|Contour Extraction and Quality Inspection for Inner Structure of Deep Hole Components|
|Source Publication||IEEE Transactions on Components, Packaging and Manufacturing Technology
|Abstract||The paper focuses on the contour extraction for the inner wires of a kind of deep hole component to achieve a high-accuracy inspection. The vision system consisting of a cam-era and an endoscope is developed to acquire high-quality images of the internal structure. For the acquired images, a contour ex-traction method is proposed, which could be divided into the following steps. Firstly, the start points of wires referred as the prior information on the component are obtained with a prede-fined filter, and on the basis, several regions of interest (ROIs) are defined. Secondly, the multiscale probability of boundary (mpb) operator is utilized to detect edges in the ROIs. Thirdly, a Brownian motion model is established to calculate the connectiv-ity between edges. The prior information obtained previously is used again to determine the probabilities of the edges belonging to the contours. Finally, the symmetric ratio contour (SRC) method is used to form the wires’ contours with the edges. In the proposed method, the edges belonging to the wires’ contours are enhanced by making full use of the prior information, resulting in the im-provement in accuracy and real-time performance. As evidenced by the experiments, the proposed method can efficiently extract the inner wires’ contours from the component’s image with low contrast conditions, noises and shadows.|
Zhang ZT. Contour Extraction and Quality Inspection for Inner Structure of Deep Hole Components[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2018(0):0.
Zhang ZT.(2018).Contour Extraction and Quality Inspection for Inner Structure of Deep Hole Components.IEEE Transactions on Components, Packaging and Manufacturing Technology(0),0.
Zhang ZT."Contour Extraction and Quality Inspection for Inner Structure of Deep Hole Components".IEEE Transactions on Components, Packaging and Manufacturing Technology .0(2018):0.
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