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Automated Pose Measurement Method Based on Multivision and Sensor Collaboration for Slice Microdevice
Shen, Fei1,2; Qin, Fangbo1,2; Zhang, Zhengtao1,2; Xu, De1,2; Zhang, Juan3,4; Wu, Wenrong3,4
Source PublicationIEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
ISSN0278-0046
2021
Volume68Issue:1Pages:488-498
Corresponding AuthorZhang, Zhengtao(zhengtao.zhang@ia.ac.cn)
AbstractIn this article, an automated method based on the multivision and sensor collaboration is proposed to achieve the precision pose measurement of microdevice with a slice micropart embedded inside. This method consists of three modules. First, the invisible attitude component measurement module based on a laser range sensor and the top view is designed to acquire the initial attitude component determined by the inside slice micropart. Second, the attitude component measurement module based on the contour primitives of interest extraction method abbreviated as contour primitives of interest extraction (CPIE) is utilized to obtain the other attitude components by extracting features from images directly. Third, an attitude controller based on the multivision is presented to achieve automated attitude component restriction ensuring that an exact attitude can be obtained when occlusion occurred. A series of experiments including entire assembly experiments are conducted and experimental results reveal that the proposed methods are effective and the attitude error is less than 0.6 degrees meeting the requirement of assembly.
KeywordImage feature extraction microassembly multimicroscopic vision control pose measurement slice microdevice
DOI10.1109/TIE.2020.2965472
Indexed BySCI
Language英语
Funding ProjectNational Key Research and Development Program of China[2017YFB1302303] ; National Natural Science Foundation of China[61873266] ; National Natural Science Foundation of China[61503378] ; Youth Innovation Promotion Association, Chinese Academy of Sciences
Funding OrganizationNational Key Research and Development Program of China ; National Natural Science Foundation of China ; Youth Innovation Promotion Association, Chinese Academy of Sciences
WOS Research AreaAutomation & Control Systems ; Engineering ; Instruments & Instrumentation
WOS SubjectAutomation & Control Systems ; Engineering, Electrical & Electronic ; Instruments & Instrumentation
WOS IDWOS:000584255900044
PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Sub direction classification智能控制
Citation statistics
Document Type期刊论文
Identifierhttp://ir.ia.ac.cn/handle/173211/41672
Collection精密感知与控制研究中心_精密感知与控制
Corresponding AuthorZhang, Zhengtao
Affiliation1.Chinese Acad Sci, Inst Automat, Res Ctr Precis Sensing & Control, Beijing 100190, Peoples R China
2.Univ Chinese Acad Sci, Sch Artificial Intelligence, Beijing 100049, Peoples R China
3.China Acad Engn Phys, Laser Fus Res Ctr, Mianyang 621900, Sichuan, Peoples R China
4.China Acad Engn Phys, Lab Precis Mfg Technol, Mianyang 621900, Sichuan, Peoples R China
First Author AffilicationChinese Acad Sci, Inst Automat, Res Ctr Precis Sensing & Control, Beijing 100190, Peoples R China
Corresponding Author AffilicationChinese Acad Sci, Inst Automat, Res Ctr Precis Sensing & Control, Beijing 100190, Peoples R China
Recommended Citation
GB/T 7714
Shen, Fei,Qin, Fangbo,Zhang, Zhengtao,et al. Automated Pose Measurement Method Based on Multivision and Sensor Collaboration for Slice Microdevice[J]. IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,2021,68(1):488-498.
APA Shen, Fei,Qin, Fangbo,Zhang, Zhengtao,Xu, De,Zhang, Juan,&Wu, Wenrong.(2021).Automated Pose Measurement Method Based on Multivision and Sensor Collaboration for Slice Microdevice.IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS,68(1),488-498.
MLA Shen, Fei,et al."Automated Pose Measurement Method Based on Multivision and Sensor Collaboration for Slice Microdevice".IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS 68.1(2021):488-498.
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