Virtual production lines design for back-end semiconductor manufacturing systems

CASIA OpenIR > 09年以前成果

	Virtual production lines design for back-end semiconductor manufacturing systems
	Tang, Y ; Zhou, MC ; Qiu, RG
发表期刊	IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
	2003-08-01
卷号	16 期号:3 页码:543-550
文章类型	Article
摘要	This paper introduces the virtual production line (VPL) concept, which initiates a new method to model the shop floor from both control and management point of view. Heuristic algorithms are presented to dynamically configure a large system into many VPLs, which ensure the line balance and efficiency, and accurately predicate the completion time for each work-order. The proposed methodology and algorithms are demonstrated through a simplified back-end semiconductor manufacturing system.
关键词	Heuristic Algorithm Manufacturing Execution System Production Configuration Virtual Production Line
WOS标题词	Science & Technology ; Technology ; Physical Sciences
关键词[WOS]	FABRICATION
收录类别	SCI
语种	英语
WOS研究方向	Engineering ; Physics
WOS类目	Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:000184695600026
引用统计	被引频次：18[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.ia.ac.cn/handle/173211/9929
专题	09年以前成果精密感知与控制研究中心
作者单位	1.Rowan Univ, Dept Elect & Comp Engn, Glassboro, NJ 08028 USA 2.New Jersey Inst Technol, Dept Elect & Comp Engn, Newark, NJ 07102 USA 3.Chinese Acad Sci, Inst Automat, Beijing 100080, Peoples R China 4.Penn State Univ, Dept Informat Sci, Malvern, PA 19355 USA
推荐引用方式 GB/T 7714	Tang, Y,Zhou, MC,Qiu, RG. Virtual production lines design for back-end semiconductor manufacturing systems[J]. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING,2003,16(3):543-550.
APA	Tang, Y,Zhou, MC,&Qiu, RG.(2003).Virtual production lines design for back-end semiconductor manufacturing systems.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING,16(3),543-550.
MLA	Tang, Y,et al."Virtual production lines design for back-end semiconductor manufacturing systems".IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING 16.3(2003):543-550.