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Automated Pose Measurement Method Based on Multivision and Sensor Collaboration for Slice Microdevice 期刊论文
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2021, 卷号: 68, 期号: 1, 页码: 488-498
作者:  Shen, Fei;  Qin, Fangbo;  Zhang, Zhengtao;  Xu, De;  Zhang, Juan;  Wu, Wenrong
收藏  |  浏览/下载：241/0  |  提交时间：2021/01/06
Image feature extraction  microassembly  multimicroscopic vision control  pose measurement  slice microdevice  
Visual Defect Inspection for Deep-Aperture Components With Coarse-to-Fine Contour Extraction 期刊论文
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2020, 卷号: 69, 期号: 6, 页码: 3262-3274
作者:  Gong, Xinyi;  Su, Hu;  Xu, De;  Zhang, Jiabin;  Zhang, Lei;  Zhang, Zhengtao
浏览  |  Adobe PDF(1324Kb)  |  收藏  |  浏览/下载：299/67  |  提交时间：2020/08/03
Coarse-fine positioning  deep-hole component  defect inspection  edge grouping  image processing