A reconfigurable low-cost memory-efficient VLSI architecture for video scaling

CASIA OpenIR > 智能制造技术与系统研究中心 > 多维数据分析（彭思龙）-技术团队

	A reconfigurable low-cost memory-efficient VLSI architecture for video scaling
	Wang, Yangang; Peng, Silong,
发表期刊	High Technology Letters,
	2013
卷号	19(2)期号:2013年02期页码:pp 137-144 (EI)
摘要	A runtime reconfigurable very-large-scale integration(VLSI) architecture for image and video scaling by arbitrary factors with good antialiasing performance is presented in this paper.Video scaling is used in a wide range of applications from broadcast,medical imaging and high-resolution video effects to video surveillance,and video conferencing.Many algorithms have been proposed for these applications,such as piecewise polynomial kernels and windowed sine kernels.The sum of three shifted versions of a B-spline function,whose weights can be adjusted for different applications,is adopted as the main filter.The proposed algorithm is confirmed to be effective on image scaling applications and also verified by many widely acknowledged image quality measures.The reconfigurable hardware architecture constitutes an arbitrary scaler with low resource consumption and high performance targeted for field programmable gate array(FPGA) devices.The scaling factor can be changed on-the-fly,and the filter can also be changed during runtime within a unifying framework.
关键词	Video Scaling / Very-large-scale Integration(Vlsi) Architecture / Polyphase Filter / Reconfiguration
文献类型	期刊论文
条目标识符	http://ir.ia.ac.cn/handle/173211/12959
专题	智能制造技术与系统研究中心_多维数据分析（彭思龙）-技术团队
推荐引用方式 GB/T 7714	Wang, Yangang,Peng, Silong,. A reconfigurable low-cost memory-efficient VLSI architecture for video scaling[J]. High Technology Letters,,2013,19(2)(2013年02期):pp 137-144 (EI).
APA	Wang, Yangang,&Peng, Silong,.(2013).A reconfigurable low-cost memory-efficient VLSI architecture for video scaling.High Technology Letters,,19(2)(2013年02期),pp 137-144 (EI).
MLA	Wang, Yangang,et al."A reconfigurable low-cost memory-efficient VLSI architecture for video scaling".High Technology Letters, 19(2).2013年02期(2013):pp 137-144 (EI).