Performance Analysis in Serial-section Electron Microscopy Image Registration of Neuronal Tissue
Chen BH(陈波昊)1,2; Xin T(辛桐)1,2; Han H(韩华)1,3,4,5; Chen X(陈曦)1
2022-04
会议名称SPIE Medical Imaging
卷号12032
页码702-709
会议日期2022-1
会议地点美国圣地亚哥
会议举办国美国
摘要

Serial-section electron microscopy is a widely used technique for neuronal circuit reconstruction. However, the continuity of neuronal structure is destroyed when the tissue block is cut into a series of sections. The neuronal morphology in different sections changes with their locations in the tissue block. These content changes in adjacent sections bring a diffculty to the registration of serial electron microscopy images. As a result, the
accuracy of image registration is strongly influenced by neuronal structure variation and section thickness. 
To evaluate registration performance, we use the spherical deformation model as a simulation of the neuron structure to analyze how registration accuracy is affected by section thickness and neuronal structure size. We mathematically describe the trend that the correlation of neuronal structures in two adjacent sections decreases with section thickness. Furthermore, we demonstrate that registration accuracy is negatively correlated with neuronal structure size and section thickness by analyzing the second-order moment of estimated translation. The experimental results of registration on synthetic data demonstrate that registration accuracy decreases with the neuronal structure size.

关键词Registration accuracy Serial section Neuronal structure Spherical deformation model
收录类别EI
资助项目Strategic Priority Research Program of the Chinese Academy of Sciences (CAS)[XDB32030200]
语种英语
文献类型会议论文
条目标识符http://ir.ia.ac.cn/handle/173211/48582
专题脑图谱与类脑智能实验室_微观重建与智能分析
通讯作者Chen X(陈曦)
作者单位1.中国科学院自动化研究所
2.中国科学院大学人工智能学院
3.中国科学院脑科学与智能技术卓越创新中心
4.中国科学院自动化研究所模式识别国家实验室
5.中国科学院大学未来技术学院
第一作者单位中国科学院自动化研究所
通讯作者单位中国科学院自动化研究所
推荐引用方式
GB/T 7714
Chen BH,Xin T,Han H,et al. Performance Analysis in Serial-section Electron Microscopy Image Registration of Neuronal Tissue[C],2022:702-709.
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