Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints

doi:10.1109/JAS.2020.1003150

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	Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints
	Jipeng Wang; Hesuan Hu; Chunrong Pan; Yuan Zhou; Liang Li
发表期刊	IEEE/CAA Journal of Automatica Sinica
ISSN	2329-9266
	2020
卷号	7 期号:3 页码:776-789
摘要	Accompanying the unceasing progress of integrated circuit manufacturing technology, the mainstream production mode of current semiconductor wafer fabrication is featured with multi-variety, small batch, and individual customization, which poses a huge challenge to the scheduling of cluster tools with single-wafer-type fabrication. Concurrent processing multiple wafer types in cluster tools, as a novel production pattern, has drawn increasing attention from industry to academia, whereas the corresponding research remains insufficient. This paper investigates the scheduling problems of dual-arm cluster tools with multiple wafer types and residency time constraints. To pursue an easy-to-implement cyclic operation under diverse flow patterns, we develop a novel robot activity strategy called multiplex swap sequence. In the light of the virtual module technology, the workloads that stem from bottleneck process steps and asymmetrical process configuration are balanced satisfactorily. Moreover, several sufficient and necessary conditions with closed-form expressions are obtained for checking the system’s schedulability. Finally, efficient algorithms with polynomial complexity are developed to find the periodic scheduling, and its practicability and availability are demonstrated by the offered illustrative examples.
关键词	Cluster tools multiple wafer types scheduling semiconductor manufacturing wafer fabrication
DOI	10.1109/JAS.2020.1003150
引用统计	被引频次：26[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.ia.ac.cn/handle/173211/42988
专题	学术期刊_IEEE/CAA Journal of Automatica Sinica
推荐引用方式 GB/T 7714	Jipeng Wang,Hesuan Hu,Chunrong Pan,et al. Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints[J]. IEEE/CAA Journal of Automatica Sinica,2020,7(3):776-789.
APA	Jipeng Wang,Hesuan Hu,Chunrong Pan,Yuan Zhou,&Liang Li.(2020).Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints.IEEE/CAA Journal of Automatica Sinica,7(3),776-789.
MLA	Jipeng Wang,et al."Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints".IEEE/CAA Journal of Automatica Sinica 7.3(2020):776-789.

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